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TC1265
800 mA Fixed-Output CMOS LDO with Shutdown
Features
* * * * * * * Very Low Dropout Voltage 800 mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection SHDN Input for Active Power Management ERROR Output Can Be Used as a Low Battery Detector (SOIC only)
Description
The TC1265 is a fixed-output, high-accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1265's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 A at full load (20 to 60 times lower than in bipolar regulators). Key features of the TC1265 include ultra low noise operation, very low dropout voltage (typically 450 mV at full load) and fast response to step changes in load. The TC1265 incorporates both overtemperature and overcurrent protection. The TC1265 is stable with an output capacitor of only 1 F and has a maximum output current of 800 mA. It is available in 8-Pin SOIC, 5-Pin TO-220 and 5-Pin DDPAK packages.
Applications
* * * * * * * Battery-operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers
Package Type
5-Pin DDPAK
Front View Tab Is GND
5-Pin TO-220
Tab Is GND
Typical Application
VIN VIN VOUT
+
TC1265
GND SHDN
C1 1 F SHDN
VOUT
TC1265
12345
TC1265
12345
BYP SHDN GND VIN VOUT
8-Pin SOIC
VOUT GND NC BYPASS 1 2 3 4 8 7 6 5 VIN NC SHDN ERROR
TC1265
(c) 2006 Microchip Technology Inc.
BYP SHDN GND VIN VOUT
DS21376D-page 1
TC1265
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage .........................................................6.5V Output Voltage.................. (VSS - 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature..........................-65C to +150C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation (Note 4) Dropout Voltage (Note 5) Sym VIN IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Min 2.7 800 VR - 2.5% VR - 2% -- -- -0.01 -- -- -- -- -- -- -- Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise IDD ISHDN PSRR IOUTSC VOUT/PD eN -- -- -- -- -- -- Typ -- -- VR 0.5% 40 0.007 0.002 20 50 150 260 450 1000 1200 80 0.05 64 1200 0.04 260 Max 6.0 -- VR + 3% -- 0.35 +0.01 30 160 480 800 1300 1200 1400 130 1 -- 1400 -- -- A A db mA V/W nV/Hz SHDN = 0V F 1 kHz VOUT = 0V Note 6 IL = IOUTMAX, F = 10 kHZ ppm/C % %/mA mV Units V mA V VR 2.5V VR = 1.8V Note 3 (VR + 1V) VIN 6V IL = 0.1 mA to IOUTMAX VR 2.5V, IL = 100 A VR 2.5V, IL = 100 mA VR 2.5V, IL = 300 mA VR 2.5V, IL = 500 mA VR 2.5V, IL = 800 mA VR = 1.8V, IL = 500 mA IL = 800 mA SHDN = VIH, IL = 0 Note 2 Conditions
VR 0.5% VR + 2.5%
Note 1: VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 6 3: (V -V ) - 10
OUTMAX OUTMIN TCV OUT = -----------------------------------------------------------------------V OUT x T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. 6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. 8: Hysteresis voltage is referenced to VR.
DS21376D-page 2
(c) 2006 Microchip Technology Inc.
TC1265
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters SHDN Input SHDN Input High Threshold SHDN Input Low Threshold ERROR Output (SOIC Only) Minimum Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis VMIN VOL VTH VHYS 1.0 -- -- -- -- -- 0.95 x VR 50 -- 400 -- -- V mV V mV Note 8 1 mA Flows to ERROR VIH VIL 45 -- -- -- -- 15 %VIN %VIN Sym Min Typ Max Units Conditions
Note 1: VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 6 3: (V -V ) - 10
OUTMAX OUTMIN TCV OUT = -----------------------------------------------------------------------V OUT x T
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. 6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. 8: Hysteresis voltage is referenced to VR.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-DDPAK Thermal Resistance, 5L-TO-220 Thermal Resistance, 8L-SOIC Note 1: JA JA JA -- -- -- 57 71 163 -- -- -- C/W C/W C/W TA TJ TA -40 -40 -65 -- -- -- +125 +125 +150 C C C (Note 1) Sym Min Typ Max Units Conditions
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125C).
(c) 2006 Microchip Technology Inc.
DS21376D-page 3
TC1265
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020 0.018 LINE REGULATION (%) 0.016 0.014
IDD (A)
150 135 120 105 90 75 60 45 30 15 0 -40C VOUT = 3V
0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40C 0C 25C 70C 85C 125C
0C
25C
70C
85C
125C
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-1: Temperature.
10.0
Line Regulation vs.
FIGURE 2-4:
IDD vs. Temperature.
NOISE (V/Hz)
1.0
DROPOUT VOLTAGE (V)
RLOAD = 50 COUT = 1F
0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000
85C 70C 25C
125C
0C -40C
0.1
0.0 0.01
0.01
1
10
100
1000
0 100 200 300 400 500 600 700 800 ILOAD (mA)
FREQUENCY (kHz)
FIGURE 2-2:
Output Noise vs. Frequency.
FIGURE 2-5: ILOAD.
3.030 3.020 3.010 3.000 VOUT (V) 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 -40C
3.0V Dropout Voltage vs.
0.0100 LOAD REGULATION (%/mA) 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 -40C 0C 25C 70C 85C 125C VOUT = 3V 1 mA to 800 mA
ILOAD =
0.1mA
ILOAD = ILOAD =
300mA 500mA
ILOAD =
800mA
0C
25C
70C
85C 125C
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-3: Temperature.
Load Regulation vs.
FIGURE 2-6:
3.0V VOUT vs.Temperature.
DS21376D-page 4
(c) 2006 Microchip Technology Inc.
TC1265
2.0 TYPICAL PERFORMANCE CURVES (CONT)
0.090 0.080 0.070 ISHDN (A) 0.060 0.050 0.040 0.030 0.020 0.010 0.000 -40C 0C 25C 70C 85C 125C
TEMPERATURE (C)
FIGURE 2-1:
ISHDN vs. Temperature.
(c) 2006 Microchip Technology Inc.
DS21376D-page 5
TC1265
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. (8-Pin SOIC) 1 2 3 4 5 6 7 8
PIN FUNCTION TABLE
Pin No. (5-Pin DDPAK) (5-Pin TO-220) 5 3 -- 1 -- 2 -- 4 Symbol VOUT GND NC BYPASS ERROR SHDN NC VIN Regulated voltage output Ground terminal No connect Reference bypass input Out-of-Regulation Flag (open-drain output) Shutdown control input No connect Unregulated supply input Description
3.1
Regulated Output Voltage (VOUT)
3.4
Out-of-Regulation Flag (ERROR)
Regulated voltage output.
3.2
Ground (GND)
Out-of-regulation flag (open-drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%.
Ground terminal.
3.5
Shutdown Control (SHDN)
3.3
Reference Bypass (BYPASS)
Reference bypass input. Connecting a 470 pF to this input further reduces output noise.
Shutdown control input. The regulator is fully enabled when a logic-high is applied to this input. The regulator enters shutdown when a logic-low is applied to this input. During shutdown, the output voltage falls to zero and the supply current is reduced to 0.05 A (typical).
3.6
Unregulated Supply (VIN)
Unregulated supply input.
DS21376D-page 6
(c) 2006 Microchip Technology Inc.
TC1265
4.0 DETAILED DESCRIPTION
4.2 ERROR Output
The TC1265 is a precision, fixed-output LDO. Unlike bipolar regulators, the TC1265's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. ERROR is driven low whenever VOUT falls out of regulation by more than - 5% (typ.). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated VOUT regardless of the programmed output voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT is at or below VTH and inactive when VOUT is above VTH + VH. As shown in Figure 4-1, ERROR can be used as a battery low flag or as a processor RESET signal (with the addition of timing capacitor C3). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V).
VOUT Hysteresis (VH)
+
+ 1 F C1
VIN
VOUT
Battery
TC1265
GND
+ 1 F C2
VOUT
V+ SHDN
Shutdown Control (to CMOS Logic or Tie to VIN, if unused)
ERROR
C3 Required Only if ERROR is used as a Processor RESET Signal (See Text)
R1 1M
BATTLOW
or RESET + 0.2 F C3
VTH
FIGURE 4-1:
Typical Application Circuit.
4.1
Output Capacitor
ERROR VIH VOL
A 1 F (min.) capacitor from VOUT to ground is required. The output capacitor should have an Effective Series Resistance (ESR) greater than 0.1 and less than 5. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C. When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors, and by employing passive filtering techniques.
FIGURE 4-2:
ERROR Output Operation.
(c) 2006 Microchip Technology Inc.
DS21376D-page 7
TC1265
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
TABLE 5-2:
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
THERMAL RESISTANCE GUIDELINES FOR TC1265 IN 5-PIN DDPAK/TO-220 PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm Thermal Resistance (JA) 25C/W 27C/W 35C/W
Copper Area (Topside)* 2500 sq mm 1000 sq mm 125 sq mm
5.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input voltage, output voltage and output current. The following equation is used to calculate worst-case actual power dissipation:
* Tab of device attached to top-side copper Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V 10% VOUTMIN = 2.7V 0.5% ILOADMAX = 275 mA TJMAX = 125C TAMAX = 95C JA = 60C/W (SOIC) Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: P D ( V INMAX - V OUTMIN )I LOADMAX P D = ( 3.3 x 1.1 ) - ( 2.7 x .995 ) 275 x 10 P D = 260 mW Maximum allowable power dissipation: T JMAX - T AMAX P DMAX = ------------------------------------- JA ( 125 - 95 ) P DMAX = ------------------------60 P DMAX = 500 mW In this example, the TC1265 dissipates a maximum of 260 mW, below the allowable limit of 500 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 500 mW into Equation 5-1, from which VINMAX = 4.6V.
-3
EQUATION 5-1:
P D = ( V INMAX - V OUTMIN )I LOADMAX Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA).
EQUATION 5-2:
Where: P DMAX T JMAX - T AMAX = ------------------------------------- JA
PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current Table 5-1 and Table 5-2 show various values of JA for the TC1265 package types.
TABLE 5-1:
THERMAL RESISTANCE GUIDELINES FOR TC1265 IN 8-PIN SOIC PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm Thermal Resistance (JA) 60C/W 60C/W 68C/W
74C/W
Copper Area (Topside)* 2500 sq mm 1000 sq mm 225 sq mm 100 sq mm
* Pin 2 is ground. Device is mounted on the top-side.
DS21376D-page 8
(c) 2006 Microchip Technology Inc.
TC1265
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead DDPAK Example
XXXXXXXXX XXXXXXXXX YYWWNNN
TC1265 3.3VET 0642256
5-Lead TO-220
Example:
XXXXXXXXX XXXXXXXXX YYWWNNN
TC1265 e3 3.3VAT^^ 0642256
8-Lead SOIC (150 mil)
XXXXXXXX XXXXYYWW NNN
Example:
1265-33V e3 OA^^0642 256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2006 Microchip Technology Inc.
DS21376D-page 9
TC1265
5-Lead Plastic (ET) (DDPAK)
Note:
)
For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E
L3
E1
D2 D D1
1 b e TOP VIEW BOTTOM VIEW
(5X) c2
A A1 c Units Dimension Limits Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Molded Package Length Overall Length Exposed Pad Length Lead Thickness Pad Thickness Lead Width Foot Length Pad Length Foot Angle Mold Draft Angle * Controlling Parameter Significant Characteristic Notes: e A A1 E E1 D D1 D2 c c2 b L L3 .330 .549 .014 .045 .026 .068 .045 -3 .170 .000 .385 .067 BSC .177 .005 .398 .256 REF .350 .577 .303 REF .020 -.032 .089 ---.026 .055 .037 .110 .067 8 7 0.36 1.14 0.66 1.73 1.14 -3 .370 .605 8.38 13.94 .183 .010 .410 4.32 0.00 9.78 L INCHES* NOM 5
MILLIMETERS MAX MIN NOM 5 1.70 BSC 4.50 0.13 10.11 6.50 REF 8.89 14.66 7.75 REF 0.51 -0.81 2.26 ---0.66 1.40 0.94 2.79 1.70 8 7 9.40 15.37 4.65 0.25 10.41 MAX
MIN
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M JEDEC equivalent: TO-252 Drawing No. C04-012 Revised 07-19-05
DS21376D-page 10
(c) 2006 Microchip Technology Inc.
TC1265
5-Lead Plastic Transistor Outline (AT) (TO-220)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
L
H1 Q
e1 e
e3
E
EJECTOR PIN (5) C1 J1
OP
A F D
Units Dimension Limits Lead Pitch Overall Lead Centers Space Between Leads Overall Height Overall Width Overall Length Flag Length Flag Thickness Through Hole Center Through Hole Diameter Lead Length Base to Bottom of Lead Lead Thickness Lead Width Mold Draft Angle e e1 e3 A E D H1 F Q P L J1 C1
INCHES* MIN .060 .263 .030 .160 .385 .560 .234 .045 .103 .146 .540 .090 .014 .025 3 MAX .072 .273 .040 .190 .415 .590 .258 .055 .113 .156 .560 .115 .022 .040 7
MILLIMETERS MIN 1.52 6.68 0.76 4.06 9.78 14.22 5.94 1.14 2.62 3.71 13.72 2.29 0.36 0.64 3 MAX 1.83 6.93 1.02 4.83 10.54 14.99 6.55 1.40 2.87 3.96 14.22 2.92 0.56 1.02 7
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side. JEDEC equivalent: TO-220 Drawing No. C04-036 Revised 08-01-05
(c) 2006 Microchip Technology Inc.
DS21376D-page 11
TC1265
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil Body (SOIC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E E1
p D 2 B n 1
h 45
c A
A2
L A1
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D h L c B
MIN
.053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0
INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12
MAX
MIN
.069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15
MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12
MAX
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057
DS21376D-page 12
(c) 2006 Microchip Technology Inc.
TC1265
APPENDIX A: REVISION HISTORY
Revision D (October 2006)
* Section 1.0 "Electrical Characteristics": Changed dropout voltage voltage typical value for IL = 500 mA from 700 to 1000 and maximum value from 1000 to 1200 for. Changed typical value for IL = 800 mA from 890 to 1200 * Section 6.0 "Packaging Information": Added pb-free symbol to package marking information * Added disclaimer to package outline drawings * Updated package outline drawings as needed * Added Appendix A - Revision History
Revision C (October 2004)
* Not Documented
Revision B (May 2002)
* Not Documented
Revision A (March 2002)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
DS21376D-page 13
TC1265
NOTES:
DS21376D-page 14
(c) 2006 Microchip Technology Inc.
TC1265
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X.XX Voltage Option XX Package XX Tape and Reel Examples:
a) b) c) d) a) b) Voltage Option:* 1.8V 2.5V 3.0V 3.3V = = = = 1.8V 2.5V 3.0V 3.3V c) d) a) b) c) d) e) f) g) h) TC1265-1.8VAT TC1265-2.5VAT TC1265-3.0VAT TC1265-3.3VAT 1.8V LDO, TO-220-5 pkg. 2.5V LDO, TO-220-5 pkg. 3.0V LDO, TO-220-5 pkg. 3.3V LDO, TO-220-5 pkg.
Device
TC1265 Fixed Output CMOS LDO with Shutdown
* Other output voltages are available. Please contact your local Microchip sales office for details. Package AT = ET = ETTR = OA = OATR = Plastic (TO-220), 5-Lead Plastic Transistor Outline (DDPAK), 5-Lead Plastic Transistor Outline (DDPAK), 5-Lead, Tape and Reel Plastic SOIC, (150 mil Body), 8-lead Plastic SOIC, (150 mil Body), 8-lead, Tape and Reel
TC1265-1.8VETTR 1.8V LDO, DDPAK-5 pkg., Tape and Reel TC1265-2.5VETTR 2.5V LDO, DDPAK-5 pkg., Tape and Reel TC1265-3.0VETTR 3.0V LDO, DDPAK-5 pkg., Tape and Reel TC1265-3.3VETTR 3.3V LDO, DDPAK-5 pkg., Tape and Reel TC1265-1.8VOA 1.8V LDO, SOIC-8 pkg. TC1265-1.8VOATR 1.8V LDO, SOIC-8 pkg., Tape and Reel TC1265-2.5VOA 2.5V LDO, SOIC-8 pkg. TC1265-2.5VOATR 2.5V LDO, SOIC-8 pkg., Tape and Reel TC1265-3.0VOA 3.0V LDO, SOIC-8 pkg. TC1265-3.0VOATR 3.0V LDO, SOIC-8 pkg., Tape and Reel TC1265-3.3VOA 3.3V LDO, SOIC-8 pkg. TC1265-3.3VOATR 3.3V LDO, SOIC-8 pkg., Tape and Reel
(c) 2006 Microchip Technology Inc.
DS21376D-page 15
TC1265
NOTES:
DS21376D-page 16
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2006 Microchip Technology Inc.
DS21376D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/19/06
DS21376D-page 18
(c) 2006 Microchip Technology Inc.

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